Complete coverage for 58 HS codes. Tongfu, Tongxiang (同福乡), a township in Zhejiang province, China. Package at Tongfu Microelectronics Co. Ltd China Important information for your attention: Please respond to this PCN by indicating your decision on the approval form, sign it and return to your sales partner before 3rd November 2020. Morningstar Rating. It offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high . It includes HS product codes and with their dollar values. PDF Final Product/Process Change Notification 0.03 (0.13%) Ex-Dividend Date. The company provides customers with a full range of . TONGFU MICROELECTRONICS CO., LTD, formerly Nantong Fujitsu Microelectronics Co., Ltd., is a China-based company, principally engaged in the packaging and testing of integrated circuits (ICs). Hefei Tongfu Microelectronics Co., Ltd. - Relationship Science Tongfu Microelectronics Co.,Ltd was founded in 1997 and is headquartered in Nantong, China. TongFu Microelectronics. 002156.CN | TongFu Microelectronics Co. Ltd. Financial ... Microelectronics Co., Ltd. to JSI Logistics Ltd. Hong Kong. Dublin, Feb. 20, 2020 (GLOBE NEWSWIRE) -- The "Development of the Global IC Packaging and Testing Industry, 2019 and Beyond " report has been added . China IC packager Tongfu sets up new fab in Xiamen There is neither change in the bill of materials nor manufacturing process. Topics referred to by the same term. Stock analysis for TongFu Microelectronics Co Ltd (002156:Shenzhen) including stock price, stock chart, company news, key statistics, fundamentals and company profile. IPD90R1K2C3ATMA1 in Reel by Infineon | Mosfets | Future ... TF AMD Microelectronics (Penang) Sdn. Tongfu（同夫, see tongqi ）, a neologism for men who have married lesbian women. On August 16, 2007, TongFu Microelectronics Co., Ltd. which was established in October 1997, became a listed company in Shenzhen Stock Exchange. Full borrower / issuer name. On March 30, 2021, the Tongfu Microelectronics Limited launched the grand opening of its 2021 Annual Suppliers Meeting at Nantong Intercontinental Hotel. Investor | Service | Contact us | 中文版 Service | Contact us | 中文版. TF AMD Microelectronics (Penang) Sdn. Toshimasa Hanaoka is Former Member-Supervisory Board at TongFu Microelectronics Co., Ltd. View Toshimasa Hanaoka's professional profile on Relationship Science, the database of decision makers. TongFu Microelectronics Co Ltd operates in the semiconductor industry. Harness the power of your relationships with RelSci Pro, the powerful platform for identifying relationship-driven business opportunities and connections that can propel your career forward. This web site is not endorsed by, directly affiliated with, maintained, authorized, or sponsored by Hefei Tongfu Microelectronics Co., Ltd.. Hefei Tongfu Microelectronics Company Limited (HTF), a qualified manufacturing facility, located in Anhui, China, will be added as a qualified site for assembly and testing of Power Integrations products in the PDIP-8B, PDIP-8C, SMD-8B and SMD-8C packages as listed below. Tongfu Microelectronics [SHE: 002156] shares slumped 5 percent in the morning since the additional share issuance will dilute existing shareholders' rights and interests. It includes HS product codes and with their dollar values. See Chinese trade for Xiamen Tongfu Microelectronics Co., Ltd. Its products include dual in-line package, small outline package, quad flat package, system in package, small outline transistor, dual flat no-lead, quad flat no-lead, ball grid array, flip chip, and bump series. TongFu Microelectronics Co; Please confirm your deletion . The . The company has 2 major shareholders. with its High Technology Assembly and Test knowhow, have been in Penang since 1972. Tongfu Microelectronics Co., Ltdの製品・サービス 一覧 Tongfu Microelectronics Co., Ltd へのお問い合わせ お問い合わせいただくにはログインいただき、プロフィール情報を入力していただく必要があります。 Shi also expects the sales revenue for the plant in Su-Xi-Tong Park to grow by more than . As one of China's three leading IC backend service firms, Tongfu Microelectronics (TFME) has managed to provide one-stop packaging and testing solutions by expanding its operation bases to offer . TongFu Microelectronics Co Ltd. 002156. Tongfu Microelectronics annual revenue increased from ¥7.2 billion in 2018 to ¥8.3 billion in 2019, a (14.5%) increase. Quote Stock Analysis News Price vs Fair Value Sustainability Trailing Returns Financials Valuation Operating . Stock analysis for TongFu Microelectronics Co Ltd (002156:Shenzhen) including stock price, stock chart, company news, key statistics, fundamentals and company profile. 2021-3-30. AAMI WAS AWARDED THREE MAJOR OF HONOURS OF HUATIAN TECHNOLOGY (XI'AN) CO., LTD. China's manufac-turing activity accelerated in November as its rebound from the pandemic gained strength, a survey showed Monday, Nov. 30, 2020, while the United Tongfu Microelectronics' high-end packaging and testing project was launched in Xiamen Haicang. TongFu Microelectronics Co., Ltd. manufactures integrated chips. TONGFU MICROELECTRONICS CO., LTD, formerly Nantong Fujitsu Microelectronics Co., Ltd., is a China-based company, principally engaged in the packaging and testing of integrated circuits (ICs). The company is specializing in integrated circuit assembling and testing. Tongfu Microelectronics 's main business is integrated circuit packaging and testing, accounting for 97.96%of revenue. The 2020 mid-year report shows that The company achieved operating income of 4.67 billion yuan, a year-on-year increase of 30.17%; net profit of 111 million yuan, a year-on-year decrease of 243.54%; earnings per share of 0.10 yuan. Nantong Tongfu Microelectronics Co.,Ltd. Its products include dual in-line package, small outline package, quad flat package, system . Tongfu Microelectronics (TFME, 通富微电子) is a provider of integrated circuit (IC) assembling and testing services to the semiconductor industry. AAMI WAS AWARDED THE HONOUR OF "EXCELLENT SUPPLIER" BY TONGFU MICROELECTRONICS LIMITED. Michael is with TongFu MicroElectronics (SZ: 002156, Revenue $1 Billion 2017) as Executive VP / CBO (Chief Business Offier) and Head of CEO Office. ST is already proceeding (formerly known as AMD Export Sdn. In the introductory part of the chapter, details about global IC Packaging and Testing market figures, both historical . Unfortunately, you don't own enough credit to see this new org chart. The Company provides assembling and testing service for memory, microprocessor, micro-controller, hybrid circuit, analog circuit . Contact Information. The project was the first important investment project for the company to complete the landing signing ceremony. Picture source:Futu. View 002156.CN financial statements in full. Its products include dual in-line package, small outline package, quad flat package, system . There are no changes in product electrical specifications. read more. USER LOGIN. Product; Transit; Company; Container Number: BMOU9400822. According to Shi Lei, the president of Tongfu Microelectronics Co, the company's overall sales revenue for this year is expected to surpass 10 billion yuan. 9/15 The First Semiconductor Summit Prior to TongFu， Michael was with XMC/YMTC as . Get the latest TongFu Microelectronics Co Ltd (002156) real-time quote, historical performance, charts, and other financial information to help you make more informed trading and investment decisions. TongFu Microelectronics FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT reliability@cypress.com or via a CYLINK CRM CASE Prepared By: Hideho Taoka Reviewed By: Kunihiro Miyazono Reliability Engineer Reliability Manager Approved By: David Hoffman Reliability Director A brief financial summary of TongFu Microelectronics Co Ltd as well as the most significant critical numbers from each of its financial reports. × Cargo #1 Description INTERGRATED CIRCUIT : Keywords intergrated circuit : HS-Code DATA . Find detailed stats on Tongfu Microelectronics revenue on Craft. Home > Reports & Monitors > Memory Packaging 2021. Ratios valuation of TongFu Microelectronics Co., Ltd. ( 002156 | CHN) The EV/EBITDA NTM ratio (also called EBITDA multiple or enterprise multiple) is a well-known company valuation metric that compares a company's overall value to its operational earning power. 2.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers. The company is specializing in integrated circuit assembling and testing. TongFu Microelectronics Co Ltd provides assembling and testing service for memory, microprocessor, micro-controller, hybrid circuit, analog circuit, and other related services throughout China. Its products include dual in-line package, small outline package, quad flat package, system . TongFu Microelectronics Co., Ltd. Nantong Fujitsu Microelectronics Ltd. Company Description: Tongfu Microelectronics Co., Ltd. is located in Nantong, Jiangsu, China and is part of the Scientific Research and Development Services Industry. One is Nantong Huada Microelectronics Group Ltd. (holding 31.25%) and the other is Fujitsu (China) Limited (holding 21.38%). TongFu Microelectronics (TFME) is a leading IC package and testing enterprise in China and bought over AMD's factories in Suzhou and Penang through fundings by China's National Integrated Circuit . The company has 2 major shareholders. As per the research conducted by MarketsandResearch.biz, the report titled Global IC Packaging and Testing Market 2021 by Company, Regions, Type and Application, Forecast to 2026 includes a lot of details that allow everyone to understand different things without difficulties. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed . 3. TongFu Microelectronics Co. General Information Description. Development of Leading Taiwanese OSAT Companies 3.1 ASE Benefits from M&A Synergy with Focus on SiP Technology Tongfu may refer to: Olyphant & Co. ( Chinese: 同孚洋行; pinyin: Tóngfú Yángháng ), was a merchant trading house or hong in 19th-century China. Corporate Governance. Tongfu Microelectronics Co., Ltd. (TFME) is a corporation specializing in IC assembling and testing and is China top three IC Package and Test Enterprise. Tongfu Microelectronics Co., Ltd. has 13,594 total employees across all of its locations and generates $1.64 billion in sales (USD). Replacement of current mold compounds with alternative material. Chinese Trade Data is another data source separate from US import data. Sample Shipment From Tongfu Microelectronics Co Ltd Bill of Lading MLCWPVG18110484. Workers test at TongFu Microelectronics Co., Ltd, an IC package in Nan-tong in east China's Jiangsu province on Nov. 14, 2020. TongFu Microelectronics manufactures integrated chips. Issuer . Shu Jiang is Secretary & Deputy General Manager at TongFu Microelectronics Co., Ltd. View Shu Jiang's professional profile on Relationship Science, the database of decision makers. In addition, some financial ratios derived from . TongFu Microelectronics Co Ltd . The company has 2 major shareholders. No.288,Chongchuan Road, Nantong, Jiangsu, China.. Ic Emballasje Og Testing markedsstørrelse 2021-2026 Nøkkelprodusenter, bransjeandel, investeringsmuligheter, fremtidige trender, markedspåvirkning, inntekt, etterspørsel og analyse av dominerende spillere er - Amkor, JCET, Tianshui Huatian Technology, Tongfu Microelectronics. All products assembled and/or tested at TongFu Microelectronics Co., Ltd. will be distributed from Hong Kong. The company valuation of TongFu Microelectronics Co., Ltd. according to these metrics is way above the market valuation of its peer group. Its products include dual in-line package, small outline package, quad flat package, system . TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. 28.82. Implementation of matrix leadframe for Package PG-TO252-3 in Tongfu Microelectronics Co., Ltd. (TFME) Detailed Change Information: Subject: Implementation of matrix leadframe for Package PG-TO252-3 in Tongfu Microelectronics Co., Ltd. (TFME) Reason: Standardization of leadframe for package PG-TO252-3 in Tongfu Microelectronics Co., Ltd. (TFME) assembly line. The following sample(s) was/were submitted and identified on behalf of the clients as : SOT23-3. Reserved Tongfu Microelectronics Co. Ltd. Nantong Fujitsu Microelectronics Co., Ltd. TFME. Delete or Cancel . Report available on November 15, 2021. They stabilized and rebounded, closing up 0.05 percent at CNY18.96 (USD2.94) today, with a market capitalization of about CNY25.2 billion. The stock name is "TongFuWeiDian" with code 002156. April 29th of 2016, marks the date when TFME (TongFu Microelectronics 通富微电) closed the transaction by acquiring 85% of AMD stake in two locations, AMD Penang, Malaysia . The remarkable world class assembly and test Multichip Module (MCM) microprocessor has been successfully manufactured at TF AMD since 2019. Wafer Level Chip Scale Packaging (WLCSP) Market 2021 Analysis by Top Players- Samsung Electronics, Amkor, Semco, Texas Instruments, JCET, PTI, ASE, Tongfu Microelectronics tanmay April 20, 2021 17 The company was founded. Phone 86 513 8505 8919. TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. Rating as of Oct 13, 2021. Bhd.) Lily Dong, Chief Financial Officer RDA Microelectronics, Inc. +86-21-5027-1108 or Leanne Sievers, EVP Shelton Group Investor Relations 949-224-3874 Rong Chen, Vice President - Investments Tsinghua . Tongfu Microelectronics Co.,Ltd's ISS Governance QualityScore as of N/A is N/A. SGS Job No. Introduction of TONGFU MICROELECTRONICS as alternate assembly site for TO220 MOSFET Products Important information for your attention: Please respond to this PCN by indicating your decision on the approval form, sign it and return to your sales partner before 18-November-2017 . TongFu Microelectronics Co. Ltd. balance sheet, income statement, cash flow, earnings & estimates, ratio and margins. Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) packaging and testing services to the semiconductor industry. . Bhd. Memory Packaging 2021. Description of change Old New 4.1 Description Samsung SDI product termination of the following references of molding compound for I2PAK, IPAK, Max247, Short IPAK, TO-220, TO-247 packages.
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